INTERNAL MECHANICAL STRESSES AND SELF-ORGANIZING PROCESSES ON "SILICON-METAL CONDENSATE" INTERFACE

Bohdan Koman, V. Yuzevych, R. Bihun

Abstract


We investigate regularities of internal stresses formation in metal condensates (Cu, Al, Cr, Au) and the peculiarities of self-organization processes in monocrystalline silicon substrates. The behavior of interphase interaction parameters on "metal film (Cu, Al, Cr, Au) - silicon" and during the phase transition in "melt (metal) - solid phase (metal)" on the investigated substrate were analyzed. The evaluation method of time formation of maximum internal stresses in metal condensates on solid substrates and mechanism of their formation were proposed. On "Si - metal (Cr, Cu, Au, Al)" interface, the energy parameters values of interfacial interaction: interfacial tension, interfacial energy, adhesion work and adhesive bonds energy were evaluated.

Keywords: interphase, interfacial tension, interfacial energy, adhesion work, adhesive bonds energy.


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DOI: http://dx.doi.org/10.30970/eli.21.1

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